Process for the production of light-emitting diode light sources with a luminescence conversion element

US7223620B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Harald Jäger · Regensburg, DE
• Herbert Brunner · Sinzing, DE

Key dates

• Filing date: Dec 11, 2003
• Grant date: May 29, 2007
• Expiry date: Mar 15, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/852
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A plurality of light-emitting diode light sources of the same kind are produced simultaneously. Each light source includes a light-emitting diode chip and a luminescence conversion element, which converts the wavelength of at least part of an electromagnetic radiation emitted by the light-emitting diode chip. In a first process, a layer composite with a light-emitting diode layer sequence applied to a carrier substrate is provided. The wafer is provided with trenches and then inserted into a cavity of a mold. A molding compound, which contains a luminescence conversion material, is driven in, so that the trenches are at least partly filled with the molding compound. The mold is then removed and the light-emitting diode light sources are separated from the layer composite. In a second process, instead of the layer composite, a plurality of light-emitting diode chips which are applied to a common carrier in a regular arrangement are provided.