Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus
US7223634B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 26, 2004 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Jul 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Exemplary embodiments of the present invention include a semiconductor device, a method for manufacturing the same, a circuit board and an electronic apparatus with increased productivity and reliability. An exemplary method for manufacturing a semiconductor device of the present invention includes forming a conductive part in a concave part on a first surface of a semiconductor substrate, the first surface having a plurality of chip mounting areas. Stacking at least one semiconductor chip in each of the chip mounting areas, providing a sealing member on the first surface of the semiconductor substrate and making part of a second surface of the semiconductor substrate thin so as to make the conductive part penetrate from the first surface to the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.