Method for fabricating fine features by jet-printing and surface treatment
US7223700B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2005 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Oct 14, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/621
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and system for masking a surface to be etched is described. The method includes the operation of heating a phase-change masking material and using a droplet source to eject droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze after upon contact with the thin-film or substrate surface. The thin-film or substrate is then treated to alter the surface characteristics, typically by depositing a self assembled monolayer on the surface. After deposition, the masking material is removed. A material of interest is then deposited over the substrate such that the material adheres only to regions not originally covered by the mask such that the mask acts as a negative resist. Using such techniques, feature sizes of devices smaller than the smallest droplet printed may be fabricated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.