Method of and apparatus for performing sequential processes requiring different amounts of time in the manufacturing of semiconductor devices
US7223702B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 14, 2005 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Jun 16, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of manufacturing a semiconductor device includes first and second processes, the latter requiring more processing time. An apparatus for performing the semiconductor manufacturing process includes a first reactor, and a plurality of second reactors for each first reactor. A first group of wafers are subjected to the first process within the first reactor, and are then transferred into a second reactor as isolated from the outside air. The first group of wafers is subjected to the second process within the second reactor. At the same time, a second group of wafers are subjected to the first process within the first reactor. After the first process is completed, the second group of wafers is transferred into an unoccupied one of the second reactors as isolated from the outside air. There, the second group of wafers is subjected to the second process. Accordingly, process failures otherwise due to the exposure of the wafers are minimized, and productivity is high despite the difference in the processing times.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.