High order silane composition, and method of forming silicon film using the composition
US7223802B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 22, 2003 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | May 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02628
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
It is an object of the present invention to provide a high order silane composition that contains a polysilane having a higher molecular weight than conventionally, this being from the viewpoints of wettability when applying onto a substrate, boiling point and safety, and hence in particular enables a high-quality silicon film to be formed easily, and also a method of forming an excellent silicon film using the composition. The present invention attains this object by providing a high order silane composition containing a polysilane obtained through photopolymerization by irradiating a solution of a photopolymerizable silane or a photopolymerizable like-liquid silane with ultraviolet light. Moreover, the present invention provides a method of forming a silicon film comprising the step of applying such a high order silane composition onto a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.