High dielectric resin composition
US7223807B2 · kind B2 · utility
21Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2004 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Jul 20, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/301
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An object of the present invention is to provide a resin composition which is capable of manufacturing a high dielectric resin film having high dielectric constant and small dielectric loss tangent. And the present invention provides high dielectric resin composition comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.