Patent · US Active

Arrangement for severing a flat workpiece of brittle material multiple times by means of a laser

US7223936B2 · kind B2 · utility

2Cited by

2References

8Claims

0Family size

Assignee

Jenoptik Automatisierungstechnik GmbH · DE

Inventors

Stefan Acker · Naumburg, DE
Ronny Ullmann · Kahla, DE
Juergen Weisser · Jena, DE

Key dates

Filing date	Jun 13, 2006
Grant date	May 29, 2007
Priority date	—
Expiry date	Jun 13, 2026

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/50
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Flat workpieces of brittle material be severed in a time-saving manner by an arrangement according to the invention by inducing thermomechanical stresses by laser radiation, particularly along severing lines in the same orientation in alternating directions, in that the arrangement has two coolant nozzles which selectively direct coolant to the workpiece and which, preferably coupled with optical means for shaping the laser beams, are mounted so as to be rotatable around the axis of the laser head.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.