Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging
US7224050B2 · kind B2 · utility
2Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2005 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | May 25, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/128
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Integrated circuit packages and their manufacture are described, wherein the packages comprise dendrimers or hyperbranched polymers. In some implementations, the dendrimers or hyperbranched polymers include repeat units having one or more ring structures and having surface groups to react with one or more components of a plastic. In some implementations, the dendrimers or hyperbranched polymers have a glass transition temperature of less than an operating temperature of the integrated circuit and form at least a partially separate phase.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.