RFID device and method of forming
US7224280B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2004 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Oct 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A radio frequency identification (RFID) inlay includes an electrical connection between a chip and an antenna. The electrical connection includes conductive interposer leads and a capacitive connection. The capacitive connection may involve putting the antenna and the interposer leads into close proximity, with dielectric pads therebetween, to allow capacitive coupling between the antenna and the interposer leads. The dielectric pads may include a non-conductive adhesive and a high dielectric material, such as a titanium oxide. The connections provide a convenient, fast, and effective way to operatively couple antennas and interposers. The RFID inlay may be part of an RFID lable or RFID tag.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.