Wafer based optical chassis and associated methods
US7224856B2 · kind B2 · utility
5Cited by
12References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2004 |
| Grant date | May 29, 2007 |
| Priority date | — |
| Expiry date | Mar 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48465
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical chassis includes a mount substrate an optoelectronic device on the mount substrate, a spacer substrate, and a sealer substrate. The mount substrate, the spacer substrate and the sealer substrate are vertically stacked and hermetically sealing the optoelectronic device. An external electrical contact for the optoelectronic device is provided outside the sealing. At least part of the optical chassis may be made on a wafer level. A passive optical element may be provided on the sealer substrate or on another substrate stacked and secured thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.