Apparatus process and method for mounting and treating a substrate
US7225819B2 · kind B2 · utility
9Cited by
2References
7Claims
0Family size
Inventor
Key dates
| Filing date | Dec 7, 2001 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Aug 17, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68757
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is a method, apparatus and process for an improved substrate mounting and processing technique for various substrate treatments comprising cleaning, dicing, sawing, polishing, and planarization, among others.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.