High resolution intravascular ultrasound transducer assembly having a flexible substrate
US7226417B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1996 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Sep 13, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An ultrasound transducer assembly of the present invention includes a flexible circuit to which an ultrasound transducer array and integrated circuitry are attached during fabrication of the ultrasound transducer assembly. The flexible circuit comprises a flexible substrate to which the integrated circuitry and transducer elements are attached while the flexible substrate is in a substantially flat shape. The flexible circuit further comprises electrically conductive lines that are deposited upon the flexible substrate. The electrically conductive lines transport electrical signals between the integrated circuitry and the transducer elements. After assembly, the flexible circuit is re-shapable into a final form such as, for example, a substantially cylindrical shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.