Printed circuit board and method for producing a printed circuit board
US7226653B2 · kind B2 · utility
1Cited by
8References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2001 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Aug 2, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board for an electronic circuit, especially for the ultra-high frequencies located in the GHz range that comprises at least one conductor layer, which is arranged on top of an insulating layer and which is flatly joined to said insulating layer. Improved mechanical, thermal and electrical properties are attained by virtue of the fact that the insulating layer is a thin glass layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.