Sensing alignment of multiple layers
US7226797B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2004 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Aug 31, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T7/0004
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Using an imaging system in relation to a plurality of material layers in an initial alignment state is provided, a first of the plurality of material layers at least partially obscuring a second of the plurality of material layers in the initial alignment state. The first material layer is moved from a first position corresponding to the initial alignment state to a second position out of a field of view of the imaging system, and a first image of the second material layer is stored. The first material layer is moved back the first position to restore the initial alignment state. A second image of the first material layer is acquired. The second image and the stored first image are processed to determine the initial alignment state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.