Reactive phenolic resins in the preparation of highly viscous self-adhesive compositions
US7226967B2 · kind B2 · utility
1Cited by
11References
11Claims
0Family size
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Key dates
| Filing date | Jul 29, 2004 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Jan 11, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/16
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Hot-melt pressure-sensitive adhesive based one or more non-thermoplastic elastomers, at least comprising 100 parts by mass of the non-thermoplastic elastomer(s), from 1 to 200 parts by mass of one or more tackifying resins, from 1 to 100 parts by mass of one or more reactive phenolic resins whose methylol content is from 1 to 20% by weight, based on the reactive phenolic resin, from 1 to 100 parts by mass of accelerator substances.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.