Methods of depositing piezoelectric films
US7227292B2 · kind B2 · utility
1Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2004 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Apr 18, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
This invention relates to methods of depositing piezoelectric films such as in part of a stack including depositing a piezoelectric layer, measuring the thickness of the layer and depositing a further film or films such that the combined thickness is substantially equal to the target thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.