Surface acoustic wave device and method of fabricating the same
US7227429B2 · kind B2 · utility
11Cited by
7References
20Claims
0Family size
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Key dates
| Filing date | Mar 26, 2004 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Mar 26, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.