Thermal sensor
US7227473B2 · kind B2 · utility
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10References
8Claims
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Key dates
| Filing date | Sep 20, 2002 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Nov 9, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K1/22
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermal sensor is provided, which is distinguished in that it includes means for removing a deposit on a sensing element of the sensor. In addition, means for detecting the deposit may be provided. The means for removing the deposit are realized by a trigger circuit for the sensing element, which brings about heating of the sensing element. In addition, a reference sensing element may be utilized as well, which is used both for indirect heating and for checking the sensing element. Due to the use of a catalytic layer on the sensing element, a deposit may be removed at relatively low temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.