Capacitor device and method of manufacturing the same
US7227736B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2005 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Feb 15, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A capacitor device includes a capacitor Q constituted by a lower electrode (12) formed an a substrate (10), a dielectric film (14), and an upper electrode (16); an insulating film (18) covering the capacitor Q; a first contact hole (18a) formed in the insulating film (18) on a connection portion (16a) of the upper electrode (16); an electrode pad (20) for preventing a diffusion of solder, formed in the first contact hole (18a); and a solder bump (22) electrically connected to the electrode pad (20), and the upper electrode (16) has a protrusion portion (16a) protruding from the dielectric film (14), and is connected to the first contact hole (18a) on the protrusion portion (16a).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.