Ventilated housing for electronic components
US7227751B2 · kind B2 · utility
26Cited by
19References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2005 |
| Grant date | Jun 5, 2007 |
| Priority date | — |
| Expiry date | Sep 21, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20563
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure for vertically housing an electronic component is disclosed as including a bottom support member and a top support member. The top support member is substantially parallel to the bottom support member. An open space is formed between the top support member and the bottom support member whereby the electronic component may be placed into the open space in a vertical orientation. A ventilating structure is disposed outside of the open space and is capable of channeling air into a middle portion of the electronic component in the open space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.