Heat dissipation device
US7228889B1 · kind B1 · utility
12Cited by
13References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 9, 2006 |
| Grant date | Jun 12, 2007 |
| Priority date | — |
| Expiry date | Jan 9, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a seat, a fin set arranged on the seat, a fan, a fan mounting device having the fan mounted thereto, and a cover covering the fin set. The fan has a portion thereof located above the fin set. An opening is defined in fan mounting device and communicates the fan with the fin set and the fan with a space above a top of the fin set. The cover has a rearwards expanding port for guiding an airflow generated by a system fan to flow through the fin set. A top wall of the cover has a void to expose a portion of the top of the fin set.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.