Interconnect structure for transducer assembly
US7229292B1 · kind B1 · utility
15Cited by
5References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2005 |
| Grant date | Jun 12, 2007 |
| Priority date | — |
| Expiry date | Dec 22, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG10K11/346
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnect assembly is presented. The assembly includes an interconnect structure including a plurality of interconnect layers disposed in a spaced relationship, where each of the plurality of interconnect layers comprises a plurality of conductive traces disposed thereon. Furthermore, the assembly includes a redistribution layer disposed proximate the interconnect structure, where the redistribution layer is configured to facilitate coupling the interconnect structure to the one or more transducer elements on the transducer array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.