Methods of and apparatus for molding structures using sacrificial metal patterns
US7229542B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 7, 2003 |
| Grant date | Jun 12, 2007 |
| Priority date | — |
| Expiry date | Jun 24, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0197
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.