Insulating film composition having improved mechanical property
US7229672B2 · kind B2 · utility
1Cited by
5References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 22, 2004 |
| Grant date | Jun 12, 2007 |
| Priority date | — |
| Expiry date | Jun 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An insulating film forming composition having good mechanical and insulating properties comprises a silica sol having a good dispersion stability, an organic siloxane polymer and a hydrophobic organic solvent, wherein the silica sol has primary-particles having an average particle size of 5 to 15 nm and secondary-particles having an average particle size of 70 to 100 nm, and the combined amount of said primary and secondary silica particles is in the range of 2 to 50% by weight based on the sum of the silica particles and organic siloxane polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.