System and method for manufacturing an out of plane integrated circuit inductor
US7229908B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2004 |
| Grant date | Jun 12, 2007 |
| Priority date | — |
| Expiry date | Aug 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/20
Abstract
A system and method is described for manufacturing an out of plane integrated circuit inductor. A plurality of parallel metal bars are formed on a substrate and covered with a first passivation layer. A ferromagnetic core is then deposited over the first passivation layer with its length perpendicular to the plurality of parallel metal bars. A second passivation layer is deposited over the ferromagnetic core and vias are etched through the passivation layers to the alternate ends of the underlying parallel metal bars. A plurality of cross connection metal bars are then formed on the second passivation layer with vertical portions that fill the vias and connect the alternate ends of the plurality of parallel metal bars to form an inductor coil. A third passivation layer is then deposited over the cross connection metal bars.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.