Porous organosilicates with improved mechanical properties
US7229934B2 · kind B2 · utility
15Cited by
2References
47Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2005 |
| Grant date | Jun 12, 2007 |
| Priority date | — |
| Expiry date | Jan 7, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/1047
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Oxycarbosilane materials make excellent matrix materials for the formation of porous low-k materials using incorporated pore generators(porogens). The elastic modulus numbers measured for porous samples prepared in this fashion are 3–6 times higher than porous organosilicates prepared using the sacrificial porogen route. The oxycarbosilane materials are used to produce integrated circuits for use in electronics devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.