Printed wire board and associated mobile terminal
US7230187B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2003 |
| Grant date | Jun 12, 2007 |
| Priority date | — |
| Expiry date | Jul 6, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0358
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive layers and insulative layers. The outermost three layers form an interconnect structure constructed of two conductive layers surrounding an insulative-coated conductive layer. The thicknesses of the various layers are optimized to have an increased resistance to mechanical shock resulting from, for instance, a drop onto a hard surface. In addition, the optimized PWB structure has a minimized thickness and an improved resistance to connection failures resulting from cyclical thermal loads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.