Printed circuit board and manufacturing method thereof
US7230818B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 22, 2005 |
| Grant date | Jun 12, 2007 |
| Priority date | — |
| Expiry date | Mar 22, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board which is thin and incorporates a large-capacitance capacitor function and a manufacturing method thereof. In one embodiment, the printed circuit board manufacturing method includes forming inner layer conductor circuits on a core substrate; forming a recess part on the core substrate; housing, in a recess part, a planar capacitor device that is not resin molded and has electrodes on the surfaces on a shared side; interposing the same between insulator resin and conductor metal foil to heat pressurize the same for forming a multi-layer plate; forming via holes for electrically connecting an outer layer conductor circuit to the electrodes of the capacitor device; forming a conductor layer on them; and forming the outer layer conductor circuits on the surfaces of the multi-layer plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.