Heat dissipation device
US7230828B2 · kind B2 · utility
3Cited by
4References
15Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 21, 2004 |
| Grant date | Jun 12, 2007 |
| Priority date | — |
| Expiry date | Jul 7, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device (30) includes a heat dissipation member (31), a positioning member (33) and a mating member (34). The heat dissipation member includes a fin set (311) and a post (312) in the fin set. The post extends through the positioning member and is mated with the mating member so that the positioning member is positioned between the fin set and the mating member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.