Contact spring and socket combination for high bandwidth probe tips
US7231704B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 18, 2005 |
| Grant date | Jun 19, 2007 |
| Priority date | — |
| Expiry date | Dec 9, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49174
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A high-bandwidth electrical test probe having a probe contact spring of reduced size and characteristic capacitance is presented. The probe includes a contact spring connected at one end to the input port of a probe circuit. The opposite end of the contact spring enters the a probe socket and a predetermined angle of entry. The probe socket has a bore formed therein which is arranged at a non-zero angle relative to the angle of entry of the contact spring into said probe socket bore, thereby guaranteeing electrical contact with the bore. The design allows the use of a very small contact spring, on the order of tens of mils, thereby reducing the parasitic capacitance of the spring and allowing much higher bandwidths than heretofore achievable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.