Injection molding coupling apparatus
US7232538B2 · kind B2 · utility
7Cited by
0References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 15, 2004 |
| Grant date | Jun 19, 2007 |
| Priority date | — |
| Expiry date | Oct 6, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4987
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Injection molding coupling apparatus and method is configured to be installed between a relatively movable injection unit and a relatively stationary unit base. A subplate is configured to be relatively movable with respect to the unit base, and preferably includes linear bearings for rolling on a pair of linear rails. A flexible pad device is configured to be disposed between the subplate and the injection unit. The flexible pad device is configured to minimize misalignment caused by thermal elongation of heated components and the relative movement between the injection unit and the unit base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.