Low void space resins and method of preparation
US7232849B2 · kind B2 · utility
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6References
9Claims
0Family size
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Key dates
| Filing date | Aug 7, 2003 |
| Grant date | Jun 19, 2007 |
| Priority date | — |
| Expiry date | Jan 15, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F2/18
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A crosslinked polymeric bead comprising a polymer having from 0.5 mole percent to 2 mole percent crosslinker. The bead has a diameter no greater than 200 μm, no void spaces having a diameter greater than 5 μm, and less than 5 weight percent of organic extractables.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.