Test board for high-frequency system level test
US7233157B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2004 |
| Grant date | Jun 19, 2007 |
| Priority date | — |
| Expiry date | Apr 13, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07378
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test board for a high-frequency system level test: The test board includes a main board having through holes filled with a conductive material. These holes may be located at a portion of the main board from which an existing module socket has been removed. An interface board has surface mounted device (SMD) pads on front and rear surfaces. The SMD pads on the front surface of the interface board are connected with the SMD pads on the rear surface thereof through cross connection wiring within the interface board for a pin swap. The through holes of the main board are connected with the SMD pads on the rear surface of the interface board via iron cores fixed at a guide. A test module socket is mounted on surfaces of the SMD pads on the front surface of the interface board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.