Curved grooving of polishing pads
US7234224B1 · kind B1 · utility
32Cited by
13References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2006 |
| Grant date | Jun 26, 2007 |
| Priority date | — |
| Expiry date | Nov 3, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T409/304424
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method is provided for forming grooves in a polishing pad useful for planarizing a substrate in a chemical mechanical planarization process. The method maintains average velocity as a function of bit diameter to enable groove formation using a rotating bit, whereby grooves can be formed at a higher rate while maintaining high groove quality and low defectivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.