Plasma processing apparatus
US7234413B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 30, 2004 |
| Grant date | Jun 26, 2007 |
| Priority date | — |
| Expiry date | Aug 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32192
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a plasma processing apparatus, microwaves being transmitted in a waveguide pass through a microwave transmitted window via first and second slot antennas provided in a magnetic field side, so as to form surface waves. Process gas in a chamber is excited by the surface waves so as to generate surface wave plasma. A substrate is processed by the plasma. Each first slot antenna is provided with an aperture, which has a curved or bent shape and whose longitudinal direction extends substantially to follow the lines of magnetic force of the microwaves. Each second slot antenna is provided with an aperture which has a rectangular shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.