Controlled-grain-precious metal sputter targets
US7235143B2 · kind B2 · utility
1Cited by
10References
4Claims
0Family size
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Key dates
| Filing date | Aug 8, 2002 |
| Grant date | Jun 26, 2007 |
| Priority date | — |
| Expiry date | Aug 9, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3414
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A precious metal sputter target has a composition selected from the group consisting of platinum, palladium, rhodium, iridium, ruthenium, osmium and single-phase alloys thereof. The sputter target's grain structure is at least about 99 percent recrystallized and has a grain size of less than about 200 μm for improving sputter uniformity. The cryogenic method for producing these sputter targets is also effective for improving sputter performance for silver and gold sputter targets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.