Method and apparatus for applying particulate material to a substrate
US7235278B2 · kind B2 · utility
3Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2005 |
| Grant date | Jun 26, 2007 |
| Priority date | — |
| Expiry date | Feb 10, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1798
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus of applying a particulate material to a substrate includes applying adhesive to the substrate and passing the substrate through a chamber in which a particulate material is suspended in a fluid in order to adhere the particulate material to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.