Fluoropolymer bonding composition and method
US7235302B2 · kind B2 · utility
1,467Cited by
39References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2003 |
| Grant date | Jun 26, 2007 |
| Priority date | — |
| Expiry date | Oct 20, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A multi-layer structure includes a fluoropolymer bonded to a substrate. The structure is prepared by exposing a bonding composition to actinic radiation, such as ultraviolet radiation, to form the bond. The bonding composition includes a light-absorbing compound and an electron donor. The bonding composition includes non-adhesive materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.