Process for removing an organic layer during fabrication of an organic electronic device and the organic electronic device formed by the process

US7235420B2 · kind B2 · utility

Assignee

• E.I. DU PONT DE NEMOURS AND COMPANY · US

Inventors

• Shiva Prakash · Lompoc, US
• Feng Li · Beijing, CN
• Linnette Amarilys Lopez Gutierrez · Bear, US

Key dates

• Filing date: Jul 13, 2004
• Grant date: Jun 26, 2007
• Expiry date: Jul 13, 2024

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50

Abstract

A process for forming an organic electronic device includes the steps of: (a) forming a first conductive member and a conductive lead over a substrate, wherein the first conductive member and conductive lead are spaced apart from each other; (b) forming an organic layer over the substrate, the first conductive member, and the conductive lead; (c) forming a patterned conductive layer over the organic layer, wherein the patterned conductive layer includes a second conductive member, and the patterned conductive layer creates an exposed portion of the organic layer and an unexposed portion of the organic layer; and (d) dry etching at least the exposed portion of the organic layer to expose a portion of the conductive lead using at least one oxygen-containing gas, wherein dry etching is performed at a pressure in a range of approximately 0.01 to 7.5 mTorr.