Power electronics component

US7236367B2 · kind B2 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Olaf Lucke · Frankfurt am Main, DE
• Bernd Thyzel · Königstein, DE

Key dates

• Filing date: Aug 29, 2002
• Grant date: Jun 26, 2007
• Expiry date: May 5, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/1572
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

The invention relates to a power electronics component that comprises a planar ceramics substrate (2) on whose one face condutor tracks (6), applied in thick-film technique, are disposed for electrically connecting electrical power components (7) of a circuit that are also disposed on the ceramics substrate (2). The ceramics substrate (2), with its other face, is brazed onto a metal a metal support element (1) that serves as a heat spreader. The support element (1) is linked with a thermoconducting housing part housing that accommodates the support element (1) in a thermoconductive manner. On the face of the support element (1) facing away from the ceramics substrate (2), approximately opposite the ceramics substrate (2), a second ceramics substrate (4) is brazed onto the ceramics substrate (2) that carries the circuit and has approximately the same dimensions.