Method of assembly and thermal management of CT detector electronics circuits
US7236562B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2005 |
| Grant date | Jun 26, 2007 |
| Priority date | — |
| Expiry date | Nov 3, 2025 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B6/035
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Disclosed herein is a method for assembly of Computed Tomography (CT) Detector electronic circuits. A thermally conductive adhesive is dispensed on a first side of a first circuit board, the first circuit board having a plurality of ball grid arrays and a plurality of thermal sensors attached to the first side of the first circuit board. The thermally conductive adhesive is also dispensed on a first side of a second circuit board, the second circuit board having a plurality of ball grid arrays and a plurality of thermal sensors attached to the first side of the second circuit board. A first heat sink is mounted to the first side of the first circuit board. A second heat sink mounted to the first side of the second circuit board. The adhesive is cured on the first and the second circuit boards. The first circuit board is attached to the second circuit board, wherein the second side of the first circuit board is adjacent to the second side of the second circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.