Method for fabricating a CPP magnetic transducer using CMP-assisted lift-off and a CMP-resistant metal layer
US7237321B2 · kind B2 · utility
5Cited by
7References
6Claims
0Family size
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Key dates
| Filing date | Jul 30, 2004 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | Sep 1, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49052
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is described which uses a CMP resistant metal layer to replace the upper dielectric layer in the track width definition phase of a TMR or CPP spin valve magnetic head. The metal which is selected to be resistant to the CMP process can be rhodium (Rh), platinum (Pt), chromium (Cr), vanadium (V), etc. The additional CMP resistance of the refill layer structure provides a much larger processing window which results in higher yields. A CPP head according to the invention has a metal layer according to the invention above the hard bias structures on the sides of the sensor which define the track width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.