Heat dissipating apparatus having micro-structure layer and method of fabricating the same
US7237337B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2004 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | Nov 24, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49353
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.