Rechargeable dispensing head
US7237578B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2004 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | Jul 19, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C5/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesive liquid dispensing apparatus includes a gun manifold, a dispensing module, and a dispensing orifice. The inlet port of the gun manifold is directly coupled with a reservoir of adhesive hot melt liquid that is fixedly attached to the manifold. The contents of the reservoir are under pressure so that the adhesive hot melt liquid is dispensed from the adhesive liquid dispensing apparatus without the need for heated supply hoses to connect the inlet port of the manifold to a remote source of adhesive hot melt liquid. Preferably, the adhesive liquid dispensing system is coupled with a robot that controls the positioning of the system during an adhesive liquid dispensing operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.