Smart card and method for manufacturing a smart card
US7237724B2 · kind B2 · utility
74Cited by
18References
5Claims
0Family size
Inventor
Key dates
| Filing date | Apr 6, 2005 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | Apr 6, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A smart card and a method for manufacturing the same wherein the smart card is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board, a filler board, attached to the top surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a thermosetting polymeric layer positioned between the top surface of the printed circuit board and the top overlay.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.