Enhanced diamond polishing
US7238088B1 · kind B1 · utility
1Cited by
4References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2006 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | Jan 5, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2982
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A grown single crystal diamond is polished using a non contact polishing technique, which leaves a residue on the diamond surface. In one embodiment, a wet chemical etch is performed to remove the residue, leaving a highly polished single crystal diamond surface. In a further embodiment, a colloidal silica solution is used in combination with rotating polishing pads to remove the residue. Both residue removing techniques may be used in further embodiments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.