Polishing pad and method of producing same
US7238097B2 · kind B2 · utility
6Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2004 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | Jan 2, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/205
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A transparent pad having a polishing surface with an average surface roughness of 5 μm or less is used as a polishing pad. An indentation is formed on the back surface of the transparent pad such that its rate of light transmission is locally changed. The transparent pad has a rate of light transmission equal to or greater than 10% or preferably 30% for light of at least one wavelength in the range of 350 nm–900 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.