Printed circuit board including pads with vacancies
US7238892B2 · kind B2 · utility
22Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2005 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | Jul 25, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods and apparatuses for affecting the frequency behavior of connections within a printed circuit board or an integrated circuit are disclosed. Some embodiments include a printed circuit board comprising, a plurality of conductive layers each comprising at least one conductive pad, where each conductive pad on the conductive layers includes a vacancy, and an insulating material disposed about the conductive layers such that the vacancies are at least partially filled with the insulating material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.