Semiconductor device having die attachment and die pad for applying tensile or compressive stress to the IC chip
US7239026B2 · kind B2 · utility
0Cited by
4References
3Claims
0Family size
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Key dates
| Filing date | May 25, 2006 |
| Grant date | Jul 3, 2007 |
| Priority date | — |
| Expiry date | May 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises a substrate, a ferroelectric capacitor which includes a ferroelectric film on the substrate, and a stress application layer which applies tensile or compressive stress to the ferroelectric film of the ferroelectric capacitor by applying stress to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.