Patent · US Expired

Method of manufacturing a piezoelectric thin film resonator, manufacturing apparatus for a piezoelectric thin film resonator, piezoelectric thin film resonator, and electronic component

US7239067B2 · kind B2 · utility

27Cited by
5References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 30, 2004
Grant dateJul 3, 2007
Priority date
Expiry dateDec 29, 2024

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH03H3/02
  • WIPO fieldBasic communication processes
  • WIPO sectorElectrical engineering

Abstract

A method of manufacturing a piezoelectric thin film resonator forms, after forming a piezoelectric film on a substrate so as to cover a lower electrode formed on the substrate, an electrode material layer for forming an upper electrode above the piezoelectric film, forms a mask of a predetermined form on the electrode material layer, and then etches the electrode material layer to form the upper electrode. Before a step of forming the electrode material layer, a protective layer for protecting the piezoelectric film during etching of the electrode material layer is formed so as to cover at least a part of the piezoelectric film where the upper electrode is not formed, and the electrode material layer is then formed so as to cover the protective layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.